The JWNC has five Headway programmable spinners used for applying a range of resist films to substrates up to eight inch wafers.
Critical pint drying is particularly useful when developing high aspect ratio resist patterns. These are easily damaged by conventional blow drying techniques and from surface tension forces which are at the phase boundary as liquid evaporates.
This is used to make electrical connections between fabricated bonding pads on substrates and the outside world - e.g. leadless chip carriers (LCCs) or circuit boards.
We have 2 oxygen barrel ashers including a Gala Instruments Plasmaprep 5 asher that are mainly used after lithography to remove residual layers of resist prior to etching or metallisation.
Ellipsometry is a method used to establish the thickness, index, loss index and roughness of thin films.
Vacuum hot plates, surface thermomenters and ovens are important for the application of resists and the development of resist patterns. This is particularly true for chemically amplified resists which commonly require a carefully controlled post exposure bake.
The JWNC has 32 laminar air flow cabinets (LAF) and each is dedicated to specific activities. Similar activities are carried out within the same laboratory - for example resist spinning, aqueous processing and mixed aqueous and organic processing.