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STS

STS ICP RIE

This is a high density plasma tool with load-lock mainly used for deep Si etching using the Bosch process. The tool is used for a range of MEMS, NEMS and silicon optoelectronic & nanoelectronic research.

Gases: SF6, C4F8, N2, Ar, He, O2

Materials etched: Si and SOI (Bosch process, mixed process), Ge, SiGe

System 100 ICP

Oxford Instruments PlasmaPro System 100 ICP180 RIE

These are load locked RIE tools with cooled / heated stages and viewing ports with interferometers to monitor the etch depth. A ICP source is used for high density plamas for deep etching of semiconductor materials. Details

Gases: Cl2, BCl3, HBr, SiCl4, CH4, CF4, O2, N2, Ar, O2, low flow O2, H2

Materials etched: III-V etching, GaAs, AlGaAs, InGaAs, InP, GaN, AlGaN, high-K, low damage nitride, Au, Pt, Pd, Al, Ti

System 100

Oxford Instruments RIE100

These are load locked RIE tools with cooled / heated stages and viewing ports with interferometers to monitor the etch depth.

Gases: SiCl4, CHF3, SF6, SiF4, C2F6, N2, Ar, O2, H2,

Materials etched: III-V etching, GaAs, AlGaAs, GaN, AlGaN, high-K, low damage nitride, Au, Pt, Pd, Al, Ti

System 100

Oxford Instruments RIE100

These are load locked RIE tools with cooled / heated stages and viewing ports with interferometers to monitor the etch depth.

Gases: SiCl4, CHF3, SF6, SiF4, C2F6, N2, Ar, O2, H2,

Materials etched: III-V etching, GaAs, AlGaAs, GaN, AlGaN, high-K, low damage nitride, Au, Pt, Pd, Al, Ti

RIE80plus

Oxford Instruments RIE80+

This is an open loaded RIE tool with a 600 W rf generator, a heated stage and viewing port with interferometer to monitor the etch depth.

Gases: SF6, CHF3, CF4, C2F6, N2, Ar, O2

Materials etched: SiO2, Si3N4, quartz, Si, Ge, SiGe

BP80 RIE

BP80 RIE

This is an open loaded RIE tool running fluorine chemistry for etching insulators.

Gases: CHF3, SF6, C2F6, N2, O2, H2,

Materials etched: SiO2, Si3N4, quartz, Si

BP80 RIE

ET340

This is an open loaded RIE tool for etching In containing materials using methane and hydrogen gases.

Gases: CH4, H2, CHF3, C2F6, Ar, N2, O2, CF4&O2

Materials etched: III-V materials with In, InP, InGaAs, InGaAsP, AlInAs, GaN, CdTe, ZnSe, NiFe, Fe and Co

BP80 RIE

Wet Etching

We have a significant number of fume cupboards and lamar flow cupboards allowing a large range of chemical etching and cleaning including HF, KOH reflux, RCA and many III-V etches.