Home > Capability > Equipment > PECVD

STS

Oxford Instruments System 100 ICP 180 PECVD

This is a high density plasma tool with load-lock mainly used room temperature deposition of low stress Si3N4. 5 nm thick films have a breakdown voltage of 4 x 106 V/cm.

Gases: SiH4, N2O, N2, Ar, He, O2, CF4&O2

PECVD

Oxford Instruments PECVD 80+

This is an open loaded PECVD tool configure to deposit Si3N4 at up to 300 oC.

Gases: SiH4, N2O, N2, NH3, Ar, He, O2, CF4&O2

PECVD

Oxford Instruments PECVD 80+

This is an open loaded PECVD tool configure to deposit SiO2 at up to 700 oC.

Gases: SiH4, N2O, N2, NH3, Ar, He, O2, CF4&O2